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Terry Alford

This course will cover various aspects of microelectronics and nanoelectronics. This field aims to advance and improve the functionality of electronic devices by scaling transistors to smaller feature sizes. The course will introduce you to essential concepts such as length scales, transistor actions, and feature sizes of integrated circuits. The course will also look at historical observations and trends using Moore’s Law, which currently guides and predict development of the Semiconductor industry. Most importantly, our goal is to highlight why packaging is so important and relevant today. Furthermore, we will also explore the anatomy and function of a semiconductor package, starting with substrate-level package interconnection to the motherboard. We will also describe features as we differentiate various types of packages and how they differ in materials, design, and reliability.

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What's inside

Syllabus

Welcome
Welcome to Introduction to Semiconductor Packaging. In this course, Dr. Terry Alford and Dr. Mitul Modi will share various aspects of microelectronics and nanoelectronics. This field aims to advance and improve the functionality of electronic devices by scaling transistors to smaller feature sizes. Our aim is to introduce you to essential concepts such as length scales, transistor actions, and feature sizes of integrated circuits. We also look at historical observations and trends using Moore’s Law, which currently guides and predict development of the Semiconductor industry. Most importantly, our goal is to highlight why packaging is so important and relevant today. Furthermore, we will also explore the anatomy and function of a semiconductor package, starting with substrate-level package interconnection to the motherboard. We will also describe features as we differentiate various types of packages and how they differ in materials, design, and reliability.
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Nanoelectronics
In this module, ASU Professor Terry Alford and Intel's Dr. Mitul Modi discuss nanoelectronics, a field that aims to advance and improve the functionality of electronic devices by scaling transistors to smaller feature sizes. Professor Alford and Dr. Mitul Modi will lead you through length scales, transistor actions, the great transistor, feature sizes, integrated circuits, Moore’s Law, and new markets. You will also learn about the new challenges for semiconductor packing that arise from nanoscale fabrication.
What is Packaging? Part 1
In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the challenges and opportunities in semiconductor packaging. He will explain why we package semiconductor die, describe the silicon to semiconductor package process flow, and how packaging is evolving to meet new market demands. He will also introduce the concept of heterogeneous integration, which enables higher functionality by combining different types of devices in a single package. You will learn how semiconductor packaging connects the silicon circuitry to the rest of the system, manages the power and signals, protects the silicon circuitry, enables cooling of the circuitry, and enables spanning many length scales.
What is Packaging? Part 2
In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses Semiconductor Packaging; the past, present, and future. Mitul will explain the significance of Moore's Law, lead you through a condensed history of semiconductor packaging, and help you to identify the importance of packaging in the future, as well as why heterogeneous integration is important to the semiconductor industry.
Anatomy of a Package Part 1
In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the components and types of semiconductor packages. He will explain how the IC chip and the package substrate are connected by the flip chip interconnect (FLI) and how the package is connected to the motherboard by the second level interconnect (SLI). He will also describe other features that are added to some packages depending on the design, performance, and usage requirements. Mitul will also compare different types of packages and how they differ in materials, design, and reliability.
Anatomy of a Package Part 2
In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the structure and function of the package substrate in semiconductor packaging. He will describe the important features in the package substrate. Mitul will also discuss how the package substrate is designed for cost and performance trade-offs.
Anatomy of a Package Part 3
In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the mechanical, thermal, and electrical functions of semiconductor packaging. He will talk about how the package is used to manage environmental stresses, IC heat, power, and signals. He will also show how packaging involves different engineering skills and knowledge.
Anatomy of a Package Part 4
In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the reliability and customer ease of use. He will explain how the customer use of a package and the market use conditions affect the reliability need and the materials/design choices for the package. You will also learn how the importance of a common package footprint and second level interconnect (SLI) for motherboard design.
Introduction to Semiconductor Packaging Course Summary
In conclusion of Introduction to Semiconductor Packaging, we would like to summarize the main takeaways. We started by sharing various aspects of nanoelectronics, transistor action, reliability, and customer ease of use. Then, we explored how Moore’s Law and market use conditions affect the packages' reliability needs and the materials/design choices. At the end, we saw how the common footprint of a motherboard or socket determines a package's substrate level interconnect. Thank you for joining us.

Good to know

Know what's good
, what to watch for
, and possible dealbreakers
Provides an overview of basic nanoelectronics concepts and how they influence packaging design
Taught by industry experts with extensive experience in semiconductor packaging
Explores the evolution of semiconductor packaging and its role in the development of the semiconductor industry
Provides a comprehensive understanding of the anatomy and function of a semiconductor package
Emphasizes the importance of packaging in managing environmental stresses, IC heat, power, and signals
Requires explicit prerequisite knowledge of semiconductor packaging

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Activities

Be better prepared before your course. Deepen your understanding during and after it. Supplement your coursework and achieve mastery of the topics covered in Introduction to Semiconductor Packaging with these activities:
Review semiconductor packaging history
Reviewing the history of semiconductor packaging will help you better understand the current state of the industry and the challenges that it faces.
Show steps
  • Read about the history of semiconductor packaging.
  • Watch a documentary about the history of semiconductor packaging.
  • Interview someone who has worked in the semiconductor packaging industry for many years.
Review Moore's Law
Refresh your understanding of Moore's Law, which is a key concept in the semiconductor industry and is frequently brought up throughout this course.
Browse courses on Moore's Law
Show steps
  • Read the Wikipedia article on Moore's Law.
  • Watch a few short videos on Moore's Law.
  • Take a quiz on Moore's Law.
Practice Solving Electronics Problems
Sharpen your problem-solving skills in electronics.
Browse courses on Electronics
Show steps
  • Find a set of practice problems online.
  • Solve the problems.
  • Check your answers.
Seven other activities
Expand to see all activities and additional details
Show all ten activities
Join a Study Group
Connect with other students to form a study group to improve learning outcomes through collaboration.
Show steps
  • Find a few other students who are taking the same course.
  • Meet regularly to discuss the course material.
  • Work together on assignments and projects.
Write a blog post about the future of semiconductor packaging
Writing a blog post about the future of semiconductor packaging will help you to think critically about the challenges and opportunities that the industry faces.
Show steps
  • Research the latest trends in semiconductor packaging.
  • Interview experts in the field.
  • Write a blog post that outlines your findings.
Read The Future of Computing
Review the history and future of computing by reading the book The Future of Computing.
Show steps
  • Read the first three chapters of the book.
  • Summarize the main points of each chapter.
  • Write a short review of the book.
Attend a Workshop on Semiconductor Packaging
Gain practical knowledge and insights into semiconductor packaging at a workshop hosted by industry professionals.
Browse courses on Semiconductor Packaging
Show steps
  • Find a workshop that fits your schedule and interests.
  • Register for the workshop.
  • Attend the workshop.
Create a Presentation on the History of Semiconductor Packaging
Enhance understanding through visual representation by creating a presentation on the history of semiconductor packaging.
Browse courses on Semiconductor Packaging
Show steps
  • Research the history of semiconductor packaging.
  • Create a storyboard for your presentation.
  • Develop the content for your presentation.
  • Record your presentation.
Design a Semiconductor Package
Apply knowledge of semiconductor packaging principles through a practical project of designing a package.
Browse courses on Semiconductor Packaging
Show steps
  • Choose a specific application for your semiconductor package.
  • Research the different types of semiconductor packages.
  • Design the layout of your semiconductor package.
  • Simulate the performance of your semiconductor package.
  • Build a prototype of your semiconductor package.
Volunteer at a Semiconductor Company
Gain hands-on experience and make valuable connections in the semiconductor industry through volunteering.
Show steps
  • Find a semiconductor company that offers volunteer opportunities.
  • Apply for a volunteer position.
  • Volunteer your time.

Career center

Learners who complete Introduction to Semiconductor Packaging will develop knowledge and skills that may be useful to these careers:
Electrical Engineer
Electrical Engineers design, develop, and test electrical and electronic systems, including semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the electrical functions of semiconductor packaging, including power management, signal integrity, and electromagnetic interference (EMI) shielding. This knowledge can help Electrical Engineers understand the electrical requirements of semiconductor packaging, and design and develop electrical components that meet these requirements.
Mechanical Engineer
Mechanical Engineers design, develop, build, and test mechanical and thermal devices, including semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the anatomy and function of a semiconductor package, including mechanical features such as package size, shape, and materials. This knowledge can help Mechanical Engineers understand the constraints and requirements of semiconductor packaging, and design and develop mechanical components that meet these requirements.
Materials Scientist
Materials Scientists research and develop new materials, including materials used in semiconductor packaging. The Introduction to Semiconductor Packaging course provides an overview of the materials used in semiconductor packaging, including metals, ceramics, and polymers. This knowledge can help Materials Scientists understand the properties and limitations of these materials, and develop new materials that meet the requirements of semiconductor packaging.
Chemical Engineer
Chemical Engineers design and operate chemical plants and processes, including processes used to manufacture semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the chemical processes used in semiconductor packaging, including photolithography, etching, and deposition. This knowledge can help Chemical Engineers understand the chemical requirements of semiconductor packaging, and design and operate chemical plants and processes that meet these requirements.
Industrial Engineer
Industrial Engineers design and improve production systems, including systems used to manufacture semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the manufacturing processes used in semiconductor packaging, including assembly, testing, and packaging. This knowledge can help Industrial Engineers understand the production requirements of semiconductor packaging, and design and improve production systems that meet these requirements.
Reliability Engineer
Reliability Engineers ensure that products are reliable, including semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the reliability engineering processes used in semiconductor packaging, including accelerated life testing, failure analysis, and reliability prediction. This knowledge can help Reliability Engineers understand the reliability requirements of semiconductor packaging, and develop and implement reliability engineering processes that meet these requirements.
Quality Assurance Engineer
Quality Assurance Engineers ensure that products meet quality standards, including semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the quality assurance processes used in semiconductor packaging, including inspection, testing, and failure analysis. This knowledge can help Quality Assurance Engineers understand the quality requirements of semiconductor packaging, and develop and implement quality assurance processes that meet these requirements.
Process Engineer
Process Engineers develop and improve manufacturing processes, including processes used to manufacture semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the manufacturing processes used in semiconductor packaging, including assembly, testing, and packaging. This knowledge can help Process Engineers understand the process requirements of semiconductor packaging, and develop and improve manufacturing processes that meet these requirements.
Manufacturing Engineer
Manufacturing Engineers design and operate manufacturing systems, including systems used to manufacture semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the manufacturing processes used in semiconductor packaging, including assembly, testing, and packaging. This knowledge can help Manufacturing Engineers understand the manufacturing requirements of semiconductor packaging, and design and operate manufacturing systems that meet these requirements.
Packaging Engineer
Packaging Engineers design and develop packaging for products, including semiconductor packaging. The Introduction to Semiconductor Packaging course provides an overview of the packaging processes used in semiconductor packaging, including materials selection, design, and testing. This knowledge can help Packaging Engineers understand the packaging requirements of semiconductor packaging, and design and develop packaging that meets these requirements.
Design Engineer
Design Engineers design and develop products, including semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the design principles used in semiconductor packaging, including materials selection, thermal management, and electrical design. This knowledge can help Design Engineers understand the design requirements of semiconductor packaging, and design and develop products that meet these requirements.
R&D Engineer
R&D Engineers research and develop new technologies, including semiconductor packaging technologies. The Introduction to Semiconductor Packaging course provides an overview of the latest semiconductor packaging technologies, including advanced materials, novel designs, and new manufacturing processes. This knowledge can help R&D Engineers understand the research and development requirements of semiconductor packaging, and develop new technologies that meet these requirements.
Technical Writer
Technical Writers write technical documentation, including documentation for semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the semiconductor packaging industry, including the different types of semiconductor packaging components and their applications. This knowledge can help Technical Writers understand the technical requirements of semiconductor packaging, and write technical documentation that meets these requirements.
Sales Engineer
Sales Engineers sell products and services, including semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the semiconductor packaging industry, including the different types of semiconductor packaging components and their applications. This knowledge can help Sales Engineers understand the products and services they are selling, and better serve their customers.
Product Manager
Product Managers develop and manage products, including semiconductor packaging components. The Introduction to Semiconductor Packaging course provides an overview of the semiconductor packaging industry, including the different types of semiconductor packaging components and their applications. This knowledge can help Product Managers understand the products they are developing and managing, and better meet the needs of their customers.

Reading list

We've selected nine books that we think will supplement your learning. Use these to develop background knowledge, enrich your coursework, and gain a deeper understanding of the topics covered in Introduction to Semiconductor Packaging.
Provides an introduction to the field of nanoelectronics, covering topics such as the physics of nanoscale devices, fabrication techniques, and applications. It would be a valuable resource for learners who want to learn more about the emerging field of nanoelectronics.
Provides a comprehensive overview of semiconductor device physics and operation. It would be a valuable resource for learners who want to gain a deeper understanding of the fundamentals of semiconductor devices.
Provides a comprehensive overview of microelectronic circuit design, covering topics such as device modeling, circuit analysis, and layout. It would be a valuable resource for learners who want to learn more about the design of microelectronic circuits.
Provides a comprehensive overview of the science and engineering of microelectronic fabrication, covering topics such as materials, processes, and devices. It would be a valuable resource for learners who want to learn more about the fabrication of microelectronic devices.
Provides a comprehensive overview of electronic materials, covering topics such as the properties, processing, and applications of electronic materials. It would be a valuable resource for learners who want to learn more about the materials used in electronic devices.
Provides a comprehensive overview of microelectronic devices and circuits, covering topics such as semiconductor devices, circuit analysis, and design. It would be a valuable resource for learners who want to gain a deeper understanding of the fundamentals of microelectronic devices and circuits.
Provides a comprehensive overview of microelectronics, covering topics such as semiconductor devices, circuit analysis, and design. It would be a valuable resource for learners who want to gain a deeper understanding of the fundamentals of microelectronics.
Provides a comprehensive overview of the advanced materials, technologies, and reliability of electronic packaging, covering topics such as the design, manufacture, and testing of electronic packages. It would be a valuable resource for learners who want to learn more about the advanced materials, technologies, and reliability of electronic packaging.

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