Advanced Semiconductor Packaging from Coursera

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Syllabus

Welcome

Welcome to Advanced Packaging! Throughout this course, we will introduce you to Pathway for Assembly and Packaging technologies for 7-nanometer silicon feature sizes and beyond. We will present the evolution and impact of packaging on product performance and innovation. Specifically, we highlight how packaging has enabled better products via the use of heterogeneous integration by improving the interconnects for thermal management and signal integrity. Thank you for joining us & we hope you enjoy the materials!

Packaging Trends Part 1

In this module you will have an opportunity to view a lecture video by Ravi Mahajan who is an Intel Fellow and the Director of Pathfinding for Assembly and Packaging technologies for 7-nanometer (7nm) silicon and beyond in the Technology Development and Manufacturing Group at Intel Corporation. In this module Dr. Mahajan will discuss the evolution and impact of packaging on product performance and innovation. He shows how packaging has enabled better products using heterogeneous integration (HI) by improving the interconnects, signaling, power delivery and thermals over the years.

Packaging Trends Part 2

In this module you will have an opportunity to view a lecture video by Dr. Ravi Mahajan, Intel Fellow. In this module Dr. Mahajan will discuss how advanced packaging technologies enable the integration of diverse components and functionalities into microelectronics systems. You will learn about the importance of advanced packaging for the future of computing and communication.

Heterogeneous Integration Part 1

In this module you will have an opportunity to view a lecture video by Dr. Ravi Mahajan, Intel Fellow. In this module Dr. Mahajan will discuss how interconnect scaling can enable complex multi-chip packages (MCPs) that combine different types of chips and technologies. You will learn about the various interconnect options and trade-offs for MCPs, and how blending 2D and 3D architectures.

Heterogeneous Integration Part 2

In this module you will have an opportunity to view a lecture video by Dr. Ravi Mahajan, Intel Fellow. In this module Dr. Mahajan will discuss the trends in interconnect scaling for microelectronics systems. You will learn how 2D and 3D die-to-die (D2D) interconnects can enable high performance, how D2D link standardization can facilitate systematic and modular design of multi-chip packages (MCPs), and how co-packaging optics can address the challenge of off-package bandwidth scaling in future systems.

Advanced Packaging End of Course Summary

In conclusion of Advanced Packaging, we would like to summarize the main takeaways. Starting with Pathway for Assembly and Packaging technologies, we discussed trends in interconnect scaling of microelectronics systems 7-nanometer (7nm) silicon and beyond. During our presentations, we saw how 2D and 3D die-to-die (D2D) interconnects can enable high performance and can facilitate the systematic and modular design of multi-chip packages (MCPs). Turning to the future, we estimated how co-packaging optics could address the challenge of off-package bandwidth scaling in future systems.

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Examines how innovations in packaging technologies have improved product performance through better thermal management and improved signaling

Covers advanced packaging technologies that enable integration of diverse components into microelectronics systems

Discusses trends in interconnect scaling for microelectronics systems, including high-performance 2D and 3D die-to-die interconnects

Taught by Ravi Mahajan, an Intel Fellow and Director of Pathfinding for Assembly and Packaging technologies for 7-nanometer silicon and beyond

Provides insights into how packaging has enabled better products via the use of heterogeneous integration

Explores how advanced packaging technologies address challenges in off-package bandwidth scaling

Activities

Be better prepared before your course. Deepen your understanding during and after it. Supplement your coursework and achieve mastery of the topics covered in Advanced Semiconductor Packaging with these activities:

Review Prerequisites for Assembly and Packaging

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Starts students off with a strong foundational understanding of the course material.

Browse courses on Semiconductors

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Review electronics fundamentals
Familiarize yourself with semiconductor processing
Research different types of assembly and packaging techniques

Review electrical engineering prerequisites

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Brush up on the basics of electrical engineering to ensure a solid foundation for this course.

Browse courses on Electrical Circuits

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Review Ohm's Law and Kirchhoff's Laws.
Go over basic circuit analysis techniques.
Refresh your understanding of semiconductor devices.

Follow tutorials on advanced packaging trends

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Gain insights into the latest trends and developments in advanced packaging.

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Identify relevant tutorials
Follow the tutorials and take notes
Discuss the tutorials with classmates or colleagues

Seven other activities

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Practice problems in heterogeneous integration

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Reinforce your understanding of heterogeneous integration concepts through practice problems.

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Identify practice problems or exercises related to heterogeneous integration.
Attempt to solve the problems on your own, referring to your notes or the course materials if needed.
Check your solutions against provided answers or discuss them with peers or instructors if available.

Join a study group to discuss course concepts

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Engage with peers to enhance understanding, ask questions, and clarify concepts.

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Identify potential study partners or join an existing study group.
Set regular meeting times and establish a study plan.
Discuss course material, ask questions, and share insights.

Design a Packaging Architecture for a Microprocessor

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Brings home the ideas learned in the course by applying the concepts to a real-world scenario.

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Identify the requirements for the microprocessor
Research different packaging options
Design the packaging architecture
Simulate the packaging architecture
Present the design to a group of peers

Practice 2D and 3D interconnect scaling techniques

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Improve understanding of interconnect scaling techniques through practice.

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Review the lecture on interconnect scaling
Find online resources on 2D and 3D interconnect scaling
Practice scaling techniques using simulation software

Create a presentation on advanced packaging trends

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Deepen your understanding of advanced packaging trends by creating a presentation.

Browse courses on Semiconductor Packaging

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Research and gather information on the latest trends in advanced packaging.
Organize your findings into a logical flow for a presentation.
Create visual aids, such as slides or diagrams, to support your presentation.
Practice delivering your presentation to enhance your confidence.

Solve practice problems on signal integrity

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Reinforce your understanding of signal integrity concepts by working through practice problems.

Browse courses on Signal Integrity

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Identify online resources or textbooks with practice problems on signal integrity.
Select problems that cover various aspects of signal integrity.
Solve the problems and verify your solutions.

Design a multi-chip package (MCP)

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Gain hands-on experience in designing MCPs using advanced packaging technologies.

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Define the requirements for the MCP
Select the appropriate packaging technology
Design the layout of the MCP
Simulate the performance of the MCP

Career center

Learners who complete Advanced Semiconductor Packaging will develop knowledge and skills that may be useful to these careers:

Project Manager

Project Managers oversee the development and implementation of electronic products. They work to ensure that the projects are completed on time and within budget. This course may be useful for Project Managers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

See salaries and explore the career path for Project Manager

Process Engineer

Process Engineers develop and improve the processes used to manufacture electronic products. They work to identify and resolve any inefficiencies in the manufacturing process. This course may be useful for Process Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Technical Writer

Technical Writers document the design and operation of electronic products. They work to ensure that the documentation is clear and concise. This course may be useful for Technical Writers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Test Engineer

Test Engineers develop and conduct tests to ensure that electronic products meet all quality standards. They work to identify and resolve any defects in the products. This course may be useful for Test Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Materials Engineer

Materials Engineers develop and test new materials for use in electronic products. They work to identify materials that are durable, reliable, and meet all regulatory requirements. This course may be useful for Materials Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Reliability Engineer

Reliability Engineers develop and conduct tests to ensure that electronic products meet all reliability standards. They work to identify and resolve any potential reliability issues. This course may be useful for Reliability Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Technical Sales Engineer

Technical Sales Engineers sell electronic products to customers. They work to identify and resolve any potential technical issues. This course may be useful for Technical Sales Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Product Design Engineer

Product Design Engineers design and develop new electronic products. They work to identify and resolve any potential design issues. This course may be useful for Product Design Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Research and Development Engineer

Research and Development Engineers develop and test new technologies for electronic products. They work to identify and resolve any potential technical challenges. This course may be useful for Research and Development Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Semiconductor Engineer

Semiconductor Engineers design, develop, test, and manufacture semiconductor devices, including transistors and integrated circuits. They also work on the packaging and assembly of these devices into electronic products. This course may be useful for Semiconductor Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Marketing Engineer

Marketing Engineers develop and execute marketing campaigns for electronic products. They work to identify and target potential customers. This course may be useful for Marketing Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Packaging Engineer

Packaging Engineers design, develop, and test the packaging for electronic products. They work to ensure that the packaging protects the product from damage and meets all regulatory requirements. This course may be useful for Packaging Engineers as it provides an overview of the latest trends in semiconductor packaging, including the use of heterogeneous integration to improve performance and innovation.

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Failure Analysis Engineer

Failure Analysis Engineers investigate the causes of failures in electronic products. They work to identify and resolve the underlying causes of these failures. This course may be useful for Failure Analysis Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Design Verification Engineer

Design Verification Engineers verify that the design of electronic products meets all functional requirements. They work to identify and resolve any design errors. This course may be useful for Design Verification Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Assembly Engineer

Assembly Engineers oversee the assembly of electronic products. They work to ensure that the products are assembled correctly and meet all quality standards. This course may be useful for Assembly Engineers as it provides an overview of the latest trends in semiconductor packaging and assembly, including the use of heterogeneous integration to improve performance and innovation.

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Advanced Semiconductor Packaging

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