Semiconductor Packaging Manufacturing from Coursera

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Syllabus

Welcome

Welcome to Semiconductor Packaging Manufacturing, where we discuss the various stages of semiconductor package manufacturing, including sort, assembly, and final test. In addition, we will also describe how to select, build, and test the packages with the die and other components to ensure the quality of the package and total assembly performance. We will also discuss the role of Process Control Systems in semiconductor manufacturing as they relate to quality testing. Specifically, we will explore how Process Control Systems can help identify and correct process problems that cause variation and quality issues. Finally, we also demonstrate how to use control charts to monitor the process performance. These can assist in decision-making, specifically when to take action to improve the process.

Introduction to Semiconductor Package Manufacturing 1

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses semiconductor package manufacturing. He will explain how semiconductor packaging is a complex process and discuss the three primary phases: sort, assembly, and final test.

Introduction to Semiconductor Package Manufacturing 2

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses process flows for different types of semiconductor packages. He will explain how most process flows consist of three basic steps: sort, assembly, and final test. You will learn the details of how these steps vary depending on the package type. Mitul will give examples of process flows for BGA, LGA, 3D stacked LGA, and Stacked Hybrid packages. He will also mention that there are many more possible scenarios for process flows in semiconductor packaging.

Assembly Part 1

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the assembly process of semiconductor packaging and their purposes. He explains how the die is prepared, attached to a substrate, and the importance of the epoxy process. He also discuss other assembly techniques for each of these steps.

Assembly Part 2

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the different types of assembly steps in semiconductor packaging and their purposes. You will learn about the optional steps of IHS attach and ball attach, and how they improve the performance and reliability of the packages.

Test and Finish

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the test and final stages of semiconductor packaging and their importance. Mitul describes how sort, burn-in, test and finish operations ensure the quality, functionality and reliability of the packages before they are delivered to the customer.

Process Control Systems (PCS)

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the role and benefits of Process Control Systems (PCS) in semiconductor manufacturing. He will explain how PCS can detect and correct process problems that cause variation and quality issues. He will also define the concepts of targets, variation, common and special causes, control limits, and stability. Mitul will demonstrate how to use control charts to monitor the process performance and to decide when to take action to improve the process.

Semiconductor Packaging Manufacturing Course Summary

In conclusion of Introduction to Semiconductor Packaging, we would like to summarize the main takeaways. We started by sharing various aspects of nanoelectronics, transistor action, reliability, and customer ease of use. Then, we explored how Moore’s Law and market use conditions affect the packages' reliability needs and the materials/design choices. At the end, we saw how the common footprint of a motherboard or socket determines a package's substrate level interconnect. Thank you for joining us.

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Teaches the latest industry standard processes for semiconductor packaging manufacturing

Provides overview of different types of semiconductor packages

Covers process flows for BGA, LGA, 3D stacked LGA, and Stacked Hybrid packages

Describes the purposes of various assembly steps in semiconductor packaging

Provides knowledge about the test and finish stages in semiconductor packaging

Offers insights into Process Control Systems (PCS) and their significance in identifying and rectifying process problems

Activities

Be better prepared before your course. Deepen your understanding during and after it. Supplement your coursework and achieve mastery of the topics covered in Semiconductor Packaging Manufacturing with these activities:

Review transistor fundamentals

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Review the basics of transistor operation to build a stronger foundation for the course materials

Browse courses on Transistors

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Review textbook or online materials on transistor theory
Solve practice problems on transistor biasing and operation

Organize and review course materials

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Stay organized and improve comprehension by reviewing and organizing course materials

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Gather all course materials, including lecture notes, handouts, and assignments
Organize the materials chronologically or by topic
Review the materials regularly to reinforce understanding

Explore online tutorials on semiconductor packaging

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Enhance understanding of semiconductor packaging techniques and processes

Browse courses on Semiconductor Packaging

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Identify reputable online platforms offering tutorials on semiconductor packaging
Select tutorials that cover topics relevant to the course
Follow the tutorials, take notes, and complete any practice exercises provided

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Form a study group with classmates

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Enhance learning through discussions, quizzing, and mutual support

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Identify classmates who are motivated and share similar learning goals
Establish a regular meeting time and location for study sessions
Take turns leading discussions, reviewing materials, and quizzing each other

Solve semiconductor packaging practice problems

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Reinforce comprehension by practicing semiconductor packaging calculations and analysis

Browse courses on Semiconductor Packaging

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Identify online or textbook resources that provide semiconductor packaging practice problems
Select problems that cover a range of topics related to the course
Solve the problems and check your solutions against provided answer keys or online forums

Build a simple amplifier circuit

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Design and build a basic amplifier circuit to reinforce understanding of semiconductor packaging

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Design the amplifier circuit using circuit simulation software
Assemble the circuit on a breadboard or perfboard
Test the amplifier circuit and verify its functionality

Attend a workshop on semiconductor packaging

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Gain hands-on experience and expert insights by attending a semiconductor packaging workshop

Browse courses on Semiconductor Packaging

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Research and identify reputable workshops that align with the course topics
Register for the workshop and prepare any necessary materials
Attend the workshop, participate actively, and take detailed notes

Contribute to an open-source semiconductor packaging project

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Gain practical experience and contribute to the semiconductor packaging community

Browse courses on Semiconductor Packaging

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Identify open-source semiconductor packaging projects that align with your interests
Join the project community and familiarize yourself with their codebase and contribution guidelines
Propose and develop a feature or bug fix for the project

Career center

Learners who complete Semiconductor Packaging Manufacturing will develop knowledge and skills that may be useful to these careers:

Process Control Engineer

Process Control Engineers are responsible for maintaining and improving the quality of semiconductor manufacturing processes. The Semiconductor Packaging Manufacturing course provides a strong foundation for this role, as it covers the principles of process control and quality assurance in semiconductor manufacturing. This knowledge enables Process Control Engineers to develop and implement strategies to reduce variation and improve the overall quality of semiconductor devices.

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Manufacturing Engineer

Manufacturing Engineers play a vital role in designing, developing, and optimizing semiconductor manufacturing processes. The Semiconductor Packaging Manufacturing course provides a comprehensive overview of the various stages of semiconductor package manufacturing, including sort, assembly, and final test. This knowledge enables Manufacturing Engineers to understand the complexities of semiconductor manufacturing and develop innovative solutions to improve efficiency and productivity.

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Quality Assurance Engineer

The Semiconductor Packaging Manufacturing course may be of interest to aspiring Quality Assurance Engineers who seek to work in the semiconductor industry. It delves into the significance of process control systems (PCS) and the utilization of control charts to monitor process performance, concepts essential for ensuring the quality of semiconductor packages. By understanding these aspects, Quality Assurance Engineers can contribute to the production of reliable semiconductor devices that meet industry standards.

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Failure Analysis Engineer

Failure Analysis Engineers investigate the causes of semiconductor device failures, working to improve product quality and reliability. The Semiconductor Packaging Manufacturing course provides a solid foundation for this role, as it covers the various stages of semiconductor package manufacturing and the potential issues that can arise during each stage. By understanding the manufacturing process, Failure Analysis Engineers can more effectively analyze failures and identify corrective actions to prevent future occurrences.

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Project Manager

Project Managers are responsible for planning, executing, and controlling semiconductor manufacturing projects. The Semiconductor Packaging Manufacturing course provides a comprehensive overview of the various stages of semiconductor package manufacturing, including sort, assembly, and final test. This knowledge enables Project Managers to better understand the complexities of semiconductor manufacturing projects and to effectively manage these projects to successful completion.

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Reliability Engineer

Reliability Engineers play a crucial role in the semiconductor industry, ensuring the dependability and longevity of semiconductor devices. The Semiconductor Packaging Manufacturing course aligns well with their responsibilities, providing insights into the assembly and testing stages of semiconductor package manufacturing. Understanding these processes enables Reliability Engineers to identify potential failure modes and develop strategies to enhance product reliability, ultimately contributing to customer satisfaction and brand reputation.

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Design Engineer

Design Engineers are responsible for designing and developing semiconductor devices and systems. The Semiconductor Packaging Manufacturing course provides a valuable foundation for this role, as it covers the various aspects of semiconductor package design, including materials selection, thermal management, and electrical performance. This knowledge enables Design Engineers to develop semiconductor devices that meet the performance, reliability, and cost requirements of customers.

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Semiconductor Manufacturing Technician

Semiconductor Manufacturing Technicians are responsible for operating and maintaining the equipment used to manufacture semiconductors. The Semiconductor Packaging Manufacturing course may be useful for those seeking to become Semiconductor Manufacturing Technicians, as it provides an overview of the various stages of semiconductor package manufacturing, including sort, assembly, and final test. This knowledge can help Semiconductor Manufacturing Technicians better understand the processes involved in semiconductor manufacturing and how to operate and maintain the equipment used in these processes.

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Applications Engineer

Applications Engineers provide technical support to customers who use semiconductor devices and systems. The Semiconductor Packaging Manufacturing course provides a comprehensive overview of the various stages of semiconductor package manufacturing, including sort, assembly, and final test. This knowledge enables Applications Engineers to better understand the capabilities and limitations of semiconductor devices and to provide effective technical support to customers.

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Sales Engineer

Sales Engineers are responsible for selling semiconductor devices and systems to customers. The Semiconductor Packaging Manufacturing course provides a comprehensive overview of the various stages of semiconductor package manufacturing, including sort, assembly, and final test. This knowledge enables Sales Engineers to better understand the features and benefits of semiconductor devices and to effectively communicate these to customers.

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Technical Writer

Technical Writers are responsible for creating technical documentation for semiconductor devices and systems. The Semiconductor Packaging Manufacturing course provides a comprehensive overview of the various stages of semiconductor package manufacturing, including sort, assembly, and final test. This knowledge enables Technical Writers to create accurate and informative technical documentation for semiconductor devices and systems.

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Semiconductor Process Engineer

The Semiconductor Packaging Manufacturing course may be useful for those seeking to become Semiconductor Process Engineers, who are responsible for designing, developing, and improving semiconductor manufacturing processes. The course provides a foundation in the principles of semiconductor packaging manufacturing, including process control and quality assurance. This knowledge can help Semiconductor Process Engineers develop and implement effective processes for manufacturing semiconductors.

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Materials Scientist

Materials Scientists are responsible for researching and developing new materials for use in a variety of industries, including the semiconductor industry. The Semiconductor Packaging Manufacturing course may be useful for those seeking to become Materials Scientists in the semiconductor industry, as it provides an overview of the various materials used in semiconductor packaging, including their properties and applications. This knowledge can help Materials Scientists develop new materials that improve the performance and reliability of semiconductor devices.

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Product Engineer

Product Engineers are responsible for designing, developing, and testing new products. The Semiconductor Packaging Manufacturing course may be useful for those seeking to become Product Engineers in the semiconductor industry, as it provides an overview of the various stages of semiconductor package manufacturing, including sort, assembly, and final test. This knowledge can help Product Engineers design and develop semiconductor products that meet the needs of customers.

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Semiconductor Manufacturing Manager

This course may be useful for Semiconductor Manufacturing Managers, who are responsible for managing and overseeing the production of semiconductors. The course provides an overview of the various stages of semiconductor package manufacturing, including sort, assembly, and final test. This knowledge can help Semiconductor Manufacturing Managers better understand the processes involved in semiconductor manufacturing and make informed decisions about production.

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Semiconductor Packaging Manufacturing

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